Substrate loading system

ABSTRACT

Methods, systems, and apparatus for a substrate transfer method, including positioning a tray handler device in a first position with i) cutouts of an aperture of the first tray in superimposition with respective pedestals of a pedestal platform and ii) a distal end of the pedestals extending away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the aperture of the first tray, while concurrently engaging the second tray handler with the second tray; and increasing a distance between the top surface of the second tray and the bottom surface of a chuck to transfer a second substrate from the chuck to the tabs defined by the second tray.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of the filing date of U.S.Provisional Application No. 62/416,916, filed on Nov. 3, 2016. Thecontents of U.S. Application No. 62/416,916 are incorporated herein byreference in their entirety.

TECHNICAL FIELD

This invention relates to the loading of substrates, such assemiconductor wafers, in systems and methods involving microlithographyand similar nano-fabrication techniques.

BACKGROUND

Nano-fabrication includes the fabrication of very small structures thathave features on the order of 100 nanometers or smaller. One applicationin which nano-fabrication has had a sizeable impact is in the processingof integrated circuits. The semiconductor processing industry continuesto strive for larger production yields while increasing the circuits perunit area formed on a substrate, therefore nano-fabrication becomesincreasingly important. Nano-fabrication provides greater processcontrol while allowing continued reduction of the minimum featuredimensions of the structures formed. Other areas of development in whichnano-fabrication has been employed include biotechnology, opticaltechnology, mechanical systems, and the like.

However, transportation of substrates throughout different modules of anano-fabrication system can affect throughput of the system. Improvingthe transportation of the substrates can result in loweringloading/unloading times of the substrates, and increase throughput,which is desirable.

SUMMARY

Innovative aspects of the subject matter described in this specificationmay be embodied in methods that include the actions of providing a trayhandler device including a first tray handler positioned opposite asecond tray handler; providing a first tray and a second tray, each ofthe first and the second trays defining an aperture and each having atop surface, each aperture defining at least two cutouts and two tabs;providing a substrate chuck having a top surface and a bottom surface;engaging the first tray handler with the first tray; positioning thetray handler device in a first position with i) the cutouts of theaperture of the first tray in superimposition with respective pedestalsof a pedestal platform and ii) a distal end of the pedestals extendingaway from the top surface of the first tray; increasing a distancebetween the top surface of the first tray and a top surface of thepedestal platform to transfer a first substrate from the pedestals tothe tabs defined by the aperture of the first tray, while concurrentlyengaging the second tray handler with the second tray; increasing adistance between the top surface of the second tray and the bottomsurface of the substrate chuck to transfer a second substrate from thesubstrate chuck to the tabs defined by the second tray; rotating thetray handler device from the first position to a second position with i)the tabs defined by the aperture of the first tray in superimpositionwith respective channels of the substrate chuck and ii) the cutouts ofthe aperture of the second tray in superimposition with respectivepedestals; decreasing a distance between the top surface of the firsttray and the bottom surface of the substrate chuck to transfer the firstsubstrate from the tabs defined by the aperture of the first tray to thetop surface of the substrate chuck while the tabs defined by theaperture of the first tray are disposed within the respective channelsof the substrate chuck; and disengaging the first tray handler from thefirst tray while concurrently decreasing a distance between the topsurface of the second tray and the top surface of the pedestal platformto transfer the second substrate from the tabs defined by the apertureof the second tray to the pedestals.

Other embodiments of these aspects include corresponding systems andapparatus.

These and other embodiments may each optionally include one or more ofthe following features. For instance, removing the second substrate frombeing positioned on the pedestals; positioning a third substrate on thepedestals; and after disengaging the first tray handler from the firsttray, forming a pattern in a material positioned on the first substratewhile the first substrate is positioned on the substrate chuck and thefirst tray is coupled with the substrate chuck. After forming thepattern in the material positioned on the first substrate, engaging thefirst tray handler with the first tray while concurrently increasing thedistance between the top surface of the second tray and the top surfaceof the pedestal platform to transfer the third substrate from thepedestals to the tabs defined by the aperture of the second tray. Afterengaging the first tray handler with the first tray, increasing thedistance between the top surface of the first tray and the bottomsurface of the substrate chuck to transfer the first substrate from thesubstrate chuck to the tabs of defined by the first tray. Afterincreasing the distance between the top surface of the first tray andthe bottom surface of the substrate chuck, rotating the tray handlerdevice from the second position to the first position with the cutoutsof the aperture of the first tray in superimposition with respectivepedestals of the pedestal platform. Decreasing the distance between thetop surface of the first tray and the top surface of the pedestalplatform to transfer the first substrate from the tabs defined by theaperture of the first tray to the pedestals. Decreasing the distancebetween the top surface of the second tray and the bottom surface of thesubstrate chuck to transfer the third substrate from the tabs defined bythe aperture of the second tray to the top surface of the substratechuck while the tabs defined by the aperture of the second tray aredisposed within the respective channels of the substrate chuck. Thesecond substrate includes a patterned layer positioned thereon prior totransfer ring the second substrate from the substrate chuck to the tabsdefined by the second tray.

Innovative aspects of the subject matter described in this specificationmay be embodied in systems that include two or more pedestals of apedestal platform; a substrate chuck having a top surface and a bottomsurface, and including channels; a first tray and a second tray, each ofthe first and the second trays defining an aperture and each having atop surface, each aperture defining at least two cutouts and two tabs; atray handler device including a first tray handler positioned opposite asecond tray handler, the first tray handler engageable with the firsttray and the second tray handler engageable with the second tray, thetray hander rotatable between first and second positions, the firstposition having i) the cutouts of the aperture of the first tray insuperimposition with respective pedestals of a pedestal platform and ii)a distal end of the pedestals extending away from the top surface of thefirst tray, the second position having i) the tabs defined by theaperture of the first tray in superimposition with respective channelsof the substrate chuck and ii) the cutouts of the aperture of the secondtray in superimposition with respective pedestals; and an actuatorsystem to, when the tray handler device is in the first position, i)increase a distance between the top surface of the first tray and a topsurface of the pedestal platform to transfer a first substrate from thepedestals to the tabs defined by the aperture of the first tray, whileconcurrently engaging the second tray handler with the second tray, andii) increase a distance between the top surface of the second tray andthe bottom surface of the substrate chuck to transfer a second substratefrom the substrate chuck to the tabs defined by the second tray, andwhen the tray handler is in the second position, i) decrease a distancebetween the top surface of the first tray and the bottom surface of thesubstrate chuck to transfer the first substrate from the tabs defined bythe aperture of the first tray to the top surface of the substrate chuckwhile the tabs defined by the aperture of the first tray are disposedwithin the respective channels of the substrate chuck, and ii) decreasea distance between the top surface of the second tray and the topsurface of the pedestal platform to transfer the second substrate fromthe tabs defined by the aperture of the second tray to the pedestalswhile the first tray handler is disengaged from the first tray.

Other embodiments of these aspects include corresponding methods.

These and other embodiments may each optionally include one or more ofthe following features. For instance, the system comprising a rotationalsystem to rotate the tray handler device between the first and thesecond positions. The system comprising a patterning system to form apattern in the first substrate when the first substrate is positioned onthe top surface of the substrate chuck. The actuator system comprising afirst actuator module, the first actuator module, when the tray handlerdevice is in the first position, increase the distance between the topsurface of the first tray and a top surface of the pedestal platform totransfer a first substrate from the pedestals to the tabs defined by theaperture of the first tray, while concurrently engaging the second trayhandler with the second tray, and when the tray handler device is in thesecond position, decrease the distance between the top surface of thefirst tray and the bottom surface of the substrate chuck to transfer thefirst substrate from the tabs defined by the aperture of the first trayto the top surface of the substrate chuck while the tabs defined by theaperture of the first tray are disposed within the respective channelsof the substrate chuck. The actuator system comprising a second actuatormodule, the second actuator module, when the tray handler is in thefirst position, increase a distance between the top surface of thesecond tray and the bottom surface of the substrate chuck to transfer asecond substrate from the substrate chuck to the tabs defined by thesecond tray, and when the tray handler is in the second position, andwhen the tray handler device is in the second position, decrease thedistance between the top surface of the second tray and the top surfaceof the pedestal platform to transfer the second substrate from the tabsdefined by the aperture of the second tray to the pedestals while thefirst tray handler is disengaged from the first tray.

Particular implementations of the subject matter described in thisspecification can be implemented so as to realize one or more of thefollowing advantages. Implementations of the present disclosure mayimprove the transportation of substrates resulting in loweringloading/unloading times of the substrates, and increased throughput.

The details of one or more embodiments of the subject matter describedin this specification are set forth in the accompanying drawings and thedescription below. Other potential features, aspects, and advantages ofthe subject matter will become apparent from the description, thedrawings, and the claims.

DESCRIPTION OF DRAWINGS

FIG. 1 illustrates a simplified side view of a lithographic system.

FIG. 2 illustrates a simplified side view of a substrate having apatterned layer positioned thereon.

FIG. 3 illustrates a perspective view of a substrate loading system,including a tray handler device.

FIG. 4 illustrates a top down view of one of a portion of the trayhandler device.

FIG. 5 illustrates a side view of a substrate chuck.

FIG. 6 illustrates a side view of the substrate loading system.

FIGS. 7A-7L illustrate simplified side views of the substrate loadingsystem, including loading and unloading of substrates to and frompedestals and the substrate chuck.

FIG. 8 illustrates an example method for loading and unloading ofsubstrates to and from pedestals and the substrate chuck.

DETAILED DESCRIPTION

This document describes methods and systems that provide loading andunloading of substrates to and from pedestals and substrate chucks.Specifically, a tray handler device is provided that includes a firsttray handler positioned opposite a second tray handler. A first tray anda second tray are provided, each of the first and the second traysdefining an aperture and each having a top surface, each aperturedefining at least two cutouts and two tabs. A substrate chuck isprovided having a top surface and a bottom surface. The first trayhandler engages with the first tray. The tray handler device ispositioned in a first position with i) the cutouts of the aperture ofthe first tray in superimposition with respective pedestals of apedestal platform and ii) a distal end of the pedestals extending awayfrom the top surface of the first tray. A distance is increased betweenthe top surface of the first tray and a top surface of the pedestalplatform to transfer a first substrate from the pedestals to the tabsdefined by the aperture of the first tray, while concurrently engagingthe second tray handler with the second tray. A distance is increasedbetween the top surface of the second tray and the bottom surface of thesubstrate chuck to transfer a second substrate from the substrate chuckto the tabs defined by the second tray.

The tray handler device is rotated from the first position to a secondposition with i) the tabs defined by the aperture of the first tray insuperimposition with respective channels of the substrate chuck and ii)the cutouts of the aperture of the second tray in superimposition withrespective pedestals. A distance is decreased between the top surface ofthe first tray and the bottom surface of the substrate chuck to transferthe first substrate from the tabs defined by the aperture of the firsttray to the top surface of the substrate chuck while the tabs defined bythe aperture of the first tray are disposed within the respectivechannels of the substrate chuck. The first tray handler is disengagedfrom the first tray while concurrently decreasing a distance between thetop surface of the second tray and the top surface of the pedestalplatform to transfer the second substrate from the tabs defined by theaperture of the second tray to the pedestals.

FIG. 1 illustrates an imprint lithography system 100 that forms a reliefpattern on a substrate 102. The substrate 102 may be coupled to asubstrate chuck 104. In some examples, the substrate chuck 104 caninclude a vacuum chuck, a pin-type chuck, a groove-type chuck, anelectromagnetic chuck, and/or the like. In some examples, the substrate102 and the substrate chuck 104 may be further positioned on an airbearing 106. The air bearing 106 provides motion about the x-, y-,and/or z-axes. In some examples, the substrate 102 and the substratechuck 104 are positioned on a stage. The air bearing 106, the substrate102, and the substrate chuck 104 may also be positioned on a base 108.In some examples, a robotic system 110 positions the substrate 102 onthe substrate chuck 104.

The imprint lithography system 100 further includes an imprintlithography flexible template 112 that is coupled to one or more rollers114, depending on design considerations. The rollers 114 providemovement of a least a portion of the flexible template 112. Suchmovement may selectively provide different portions of the flexibletemplate 112 in superimposition with the substrate 102. In someexamples, the flexible template 112 includes a patterning surface thatincludes a plurality of features, e.g., spaced-apart recesses andprotrusions. However, in some examples, other configurations of featuresare possible. The patterning surface may define any original patternthat forms the basis of a pattern to be formed on substrate 102. In someexamples, the flexible template 112 may be coupled to a template chuck,e.g., a vacuum chuck, a pin-type chuck, a groove-type chuck, anelectromagnetic chuck, and/or the like.

The imprint lithography system 100 may further comprise a fluid dispensesystem 120. The fluid dispense system 120 may be used to deposit apolymerizable material on the substrate 102. The polymerizable materialmay be positioned upon the substrate 102 using techniques such as dropdispense, spin-coating, dip coating, chemical vapor deposition (CVD),physical vapor deposition (PVD), thin film deposition, thick filmdeposition, and/or the like. In some examples, the polymerizablematerial is positioned upon the substrate 102 as a plurality ofdroplets.

Referring to FIGS. 1 and 2, the imprint lithography system 100 mayfurther comprise an energy source 122 coupled to direct energy towardsthe substrate 102. In some examples, the rollers 114 and the air bearing106 are configured to position a desired portion of the flexibletemplate 112 and the substrate 102 in a desired positioning. The imprintlithography system 100 may be regulated by a processor in communicationwith the air bearing 106, the rollers 114, the fluid dispense system120, and/or the energy source 122, and may operate on a computerreadable program stored in a memory.

In some examples, the rollers 114, the air bearing 106, or both, vary adistance between the flexible template 112 and the substrate 102 todefine a desired volume therebetween that is filled by the polymerizablematerial. For example, the flexible template 112 contacts thepolymerizable material. After the desired volume is filled by thepolymerizable material, the energy source 122 produces energy, e.g.,broadband ultraviolet radiation, causing the polymerizable material tosolidify and/or cross-link conforming to shape of a surface of thesubstrate 102 and a portion of the patterning surface of the flexibletemplate 122, defining a patterned layer 150 on the substrate 102. Insome examples, the patterned layer 150 may comprise a residual layer 152and a plurality of features shown as protrusions 154 and recessions 156.

FIG. 3 illustrates a perspective view of a substrate loading system 302.In short, the substrate loading system 302 facilitates loading andunloading of substrates to and from one or more stations (e.g.,pedestals and/or substrate chucks). The substrate loading system 302includes a tray handler device 304 including a first tray handler 306positioned opposite a second tray handler 308. In some examples, thefirst tray handler 306 and the second tray handler 308 can include oneor more arms 309.

The substrate loading system 302 further includes a first tray 310 and asecond tray 312. The first tray 310 and the second tray 312 each have atop surface 314, 316, respectively. Further, the first tray 310 definesapertures 318 a, 318 b, 318 c, 318 d (collectively referred to asapertures 318) and the second tray 312 defines apertures 320 a, 320 b,320 c, 320 d (collectively referred to as apertures 320). However, thefirst tray 310 and the second tray 312 can define any number ofapertures. Each of the apertures 318, 320 define cutouts and tabs.Specifically, FIG. 4 illustrates a top down view of one of the apertures318, 320 that includes cutouts 322 a, 322 b, 322 c, 322 d (collectivelyreferred to as cutouts 322) and tabs 324 a, 324 b, 324 c, 324 d(collectively referred to as tabs 324). However, each of the apertures318, 320 can include any number of cutouts 322 and tabs 324. In someexamples, the tabs 324 include a high friction material positionedthereon, such as Viton® (available from The Chemours Company), Kalrez®(available from the DuPont™), or Simriz® (available from FreudenbergSealing Technologies).

The substrate loading system 302 further includes substrate chucks 326a, 326 b, 326 c, 326 d (collectively referred to as substrate chucks326); however, the system 302 can include any number of substrate chucks326. FIG. 5 illustrates a side view of one of the substrate chucks 326.The substrate chuck 326 includes a top surface 328 positioned opposite abottom surface 330. The substrate chuck 326 also includes channels 332positioned at a perimeter of each substrate chuck 326. In some examples,for a particular aperture 318, 320, the quantity of the channels 332matches the quantity of the tabs 324 of the particular aperture 318,320. The substrate loading system 302 further includes a pedestalplatform 334 that includes a plurality of pedestals 336 extending from atop surface 337, shown in FIG. 6. In some examples, a first subset ofthe pedestals 336 can be associated with a first height, and a secondsubset of the pedestals 336 can be associated with a second height.

Referring to FIG. 6, a side view of the substrate loading system 302 isshown. The substrate loading system 302 further includes an actuatorsystem 340 and a rotational system 342. In some examples, the actuatorsystem 340 includes a first actuator module 341 and a second actuatormodule 343. The actuator system 340 increases and/or decreases arelative positioning of the tray handler device 304, and specifically,the first tray handler 306 and the second tray handler 308, with respectto the substrate chucks 326 and the pedestals 336. The rotational system342 rotates the tray handler device 304 with respect to an axis 344. Thesubstrate loading system 302 further includes an air bearing 350 and asupport structure 352. In some examples, the air bearing 350 facilitatesmovement of the substrate chucks 326 about the support structure 352.

Referring to FIGS. 7A-7L, the substrate loading system 302 is shownfacilitating loading and unloading of substrates to and from thepedestals 336 and the substrate chuck 326. Specifically, in someimplementations, as shown in FIG. 7A, the first tray handler 306 engageswith the first tray 310. In some examples, the first tray handler 306engaging with the first tray 310 can include coupling the first trayhandler 306 and the first tray 310. In some examples, the arms 309 ofthe first tray handler 306 engage with the first tray 310 at a perimeterof the first tray 310.

In some implementations, the substrate loading system 302 positions thetray handler device 304 to be in a first position. In some examples,positioning the tray handler device 304 in the first position includeshaving the cutouts 322 of the each of the apertures 318 of the firsttray 310 in superimposition with respective pedestals 336 of thepedestal platform 334. In some examples, positioning the tray handlerdevice 304 in the first position includes a distal end 354 of each ofthe pedestals 336 extend away from the top surface 314 of the first tray310.

In some implementations, as shown in FIG. 7B, the actuator module 341increases a distance between the top surface 314 of the first tray 310and the top surface 337 of the pedestal platform 334. In some examples,increasing the distance between the top surface 314 of the first tray310 and the top surface 337 of the pedestal platform 334 includestransferring a first substrate 360 from being positioned on thepedestals 336 to the tabs 324 defined by the apertures 318 of the firsttray 310. In some examples, transferring the first substrate 360 frombeing positioned on the pedestals 336 to the tabs 324 defined by theapertures 318 of the first tray 310 includes transferring the firstsubstrate 360 from being positioned on the pedestals 336 to the tabs 324defined by the apertures 318 of the first tray 310 while the second trayhandler 308 is engaging with the second tray 312. In some examples, thesecond tray handler 308 engaging with the second tray 312 can includecoupling the second tray handler 308 and the second tray 312. In someexamples, the arms 309 of the second tray handler 308 engage with thesecond tray 312 at a perimeter of the second tray 312.

In some examples, by transferring the first substrate 360 to the tabs324 defined by the apertures 318 of the first tray 310, contact with thefirst substrate 360 is minimized. That is, by contacting the firstsubstrate 360 with only the tabs 324 defined by the apertures 318 of thefirst tray 310, contact between such is minimized. By minimizing contactwith the first substrate 360, e.g., by the tabs 324, introduction ofpossible defects to the first substrate 360 are minimized, as well as,minimizing particle contamination of the first substrate 360 by the trayhandler device 302.

In some implementations, as shown in FIG. 7C, the actuator module 343increases a distance between the top surface 316 of the second tray 312and the bottom surface 330 of the substrate chuck 326. In some examples,increasing the distance between the top surface 316 of the second tray312 and bottom surface 330 of the substrate chuck 326 includestransferring a second substrate 362 from being positioned on thesubstrate chuck 326 to the tabs 324 defined by the aperture 320 of thesecond tray 312. In some examples, the second substrate 326 includes apatterned layer 351 positioned thereon prior to transferring the secondsubstrate 362 from the substrate chuck 326 to the tabs 324 defined bythe aperture 320 of the second tray 312.

In some implementations, as shown in FIG. 7D, the rotational system 342rotates the tray handler device 304 from the first position to a secondposition. Specifically, the rotational system 342 rotates the trayhandler device 304 about the axis 344 such that the tray handler device304 is in the second position. In some examples, positioning the trayhandler device 304 in the second position includes having the tabs 324defined by the apertures 318 of the first tray 310 in superimpositionwith the channels 332 of the substrate chuck 326. In some examples,positioning the tray handler device 304 in the second position includeshaving the cutouts 322 of each of the apertures 320 of the second tray312 in superimposition with the respective pedestals 336 of the pedestalplatform 334.

In some implementations, as shown in FIG. 7E, after the rotationalsystem 342 rotates the tray handler device 304 from the first positionto the second position, the actuator module 341 decreases a distancebetween the top surface 314 of the first tray 310 and the bottom surface330 of the substrate chuck 326. In some examples, decreasing thedistance between the top surface 314 of the first tray 310 and thebottom surface 330 of the substrate chuck 326 includes transferring thefirst substrate 360 from the tabs 324 defined by the aperture 318 of thefirst tray 310 to the top surface 322 of the substrate chuck 326 whilethe tabs 324 defined by the aperture 318 of the first tray 310 aredisposed within the respective channels 332 of the substrate chuck 326.

In some implementations, as shown in FIG. 7F, the first tray handler 306disengages from the first tray 310. That is, the first tray handler 306disengaging from the first tray 310 can include decoupling the firsttray handler 306 and the first tray 310. In some examples, the arms 309of the first tray handler 306 disengage from the first tray 310 at theperimeter of the first tray 310. In some examples, the first trayhandler 306 disengages from the first tray 310 while concurrently theactuator module 343 decreases a distance between the top surface 316 ofthe second tray 312 and the top surface 337 of the pedestal platform334. In some examples, decreasing the distance between the top surface316 of the second tray 312 and the top surface 337 of the pedestalplatform 334 includes transferring the second substrate 362 from bepositioned on the tabs 324 defined by the aperture 320 of the secondtray 312 to the pedestals 336.

In some examples, after the first tray handler 306 disengages from thefirst tray 310, a patterning system, e.g., as shown in FIG. 1, forms apattern in (or in a layer positioned on) the first substrate 360.Specifically, the air bearing 350 facilitates movement of the substratechuck 326 about the support structure 352 in a direction away from thetray handler device 304 and towards the patterning system (not shown).

In some implementations, as shown in FIG. 7G, a robotic system (notshown) removes the second substrate 362 from being positioned on thepedestals 336. In some examples, the robotic system (not shown)positions a third substrate 364 on the pedestals 336. In some examples,after the first tray handler 304 disengages from the first tray 310, thepatterning system (not shown) forms a patterned layer 370 positioned onthe first substrate 360 while the first substrate 360 is positioned onthe substrate chuck 326 and the first tray 310 is coupled to thesubstrate chuck 326.

In some implementations, as shown in FIG. 7H, after the patterningsystem (not shown) forms the patterned layer 370 positioned on the firstsubstrate 360, the first tray handler 306 engages with the first tray310. In some examples, the first tray handler 306 engaging with thefirst tray 310 can include coupling the first tray handler 306 and thefirst tray 310. In some examples, the arms 309 of the first tray handler306 engage with the first tray 310 at a perimeter of the first tray 310.In some examples, concurrently with the first tray handler 306 engagingwith the first tray 310, the actuator module 343 increases a distancebetween the top surface 316 of the second tray 312 and the top surface337 of the pedestals platform 334. In some examples, increasing thedistance between the top surface 316 of the second tray 312 and the topsurface 337 of the pedestal platform 334 includes transferring the thirdsubstrate 364 from being positioned on the pedestals 336 to the tabs 324defined by the aperture 320 of the second tray 312.

In some implementations, as shown in FIG. 7I, after the first trayhandler 306 engages with the first tray 310, the actuator module 341increases the distance between the top surface 314 of the first tray 310and the bottom surface 330 of the substrate chuck 326. In some examples,increasing the distance between the top surface 314 of the first tray310 and bottom surface 330 of the substrate chuck 326 includestransferring the first substrate 360 from being positioned on thesubstrate chuck 326 to the tabs 324 defined by the aperture 318 of thefirst tray 310.

In some implementations, as shown in FIG. 7J, after the actuator module341 increases the distance between the top surface 314 of the first tray310 and the bottom surface 330 of the substrate chuck 326, therotational system 342 rotates the tray handler device 304 from thesecond position to the first position. Specifically, the rotationalsystem 342 rotates the tray handler device 304 about the axis 344 suchthat the tray handler device 304 is in the first position. In someexamples, positioning the tray handler device 304 in the first positionincludes having the cutouts 322 of the aperture 318 of the first tray310 in superimposition with respective pedestals 336 of the pedestalplatform 334.

In some implementations, as shown in FIG. 7K, the actuator module 341decreases the distance between the top surface 314 of the first tray 310and the top surface 337 of the pedestal platform 334. In some examples,decreasing the distance between the top surface 314 of the first tray310 and the top surface 337 of the pedestal platform 334 includestransferring the first substrate 360 from be positioned on the tabs 324defined by the aperture 318 of the first tray 310 to the pedestals 336.

In some implementations, as shown in FIG. 7L, the actuator module 343decreases a distance between the top surface 316 of the second tray 312and the bottom surface 330 of the substrate chuck 326. In some examples,decreasing the distance between the top surface 316 of the second tray312 and the bottom surface 330 of the substrate chuck 326 includestransferring the third substrate 364 from the tabs 324 defined by theaperture 320 of the second tray 312 to the top surface 322 of thesubstrate chuck 326 while the tabs 324 defined by the aperture 320 ofthe second tray 312 are disposed within the respective channels 332 ofthe substrate chuck 326.

In some examples, the second substrate 362 can be processed similar tothat described above with respect to the first substrate 360, andspecifically, that the process described in FIGS. 7A-7L can be appliedto the second substrate 362. In some examples, any of the steps of FIGS.7A-7L can happen serially, or in parallel.

For simplicity of illustration, a single first substrate 362, a singlesecond substrate 364, a single third substrate 366 and a singlesubstrate chuck 326 are shown; however the process of FIGS. 7A-7L can beapplied to a plurality of first substrates 362, a plurality of secondsubstrates 364, and a plurality of third substrate 366 with respect to aplurality of substrate chucks 326. That is, a plurality of firstsubstrates 362, a plurality of second substrates 364, and a plurality ofthird substrate 366 can be subject to the process of FIGS. 7A-7L,concurrently. In some examples, the process of FIGS. 7A-7L of thesubstrate loading system 302 is associated with one complete exchangecycle of the substrates is 5.3 seconds, and the substrate loading system302, specifically, the tray handler device 304, completes one revolutionin 1.5 seconds. In some examples, the substrate loading system 302, andspecifically, the rotational system 342 rotates the tray handler device304 clockwise and/or counterclockwise.

FIG. 8 illustrates an example method for loading and unloading ofsubstrates to and from pedestals and the substrate chuck. The process800 is illustrated as a collection of referenced acts arranged in alogical flow graph. The order in which the acts are described is notintended to be construed as a limitation, and any number of thedescribed acts can be combined in other orders and/or in parallel toimplement the process.

The tray handler device 304 is provided (802). In some examples, thetray handler device 304 includes the first tray handler 306 positionedopposite the second tray handler 308. The first tray 310 and the secondtray 312 are provided (804). In some examples, the first tray 310defines the apertures 318 and the second tray defines the aperture 320.In some examples, the first tray 310 has the top surface 314 and thesecond tray has the top surface 316. In some examples, each aperture318, 320 defines at least two cutouts 322 and two tabs 324. Thesubstrate chuck 326 is provided (806). In some examples, the substratechuck 326 includes the top surface 328 and the bottom surface 330. Thefirst tray handler 306 engages with the first tray 310 (808).

The tray handler device 304 is positioned in a first position (810). Insome examples, positioning the tray handler device 304 in the firstposition includes having the cutouts 322 of the each of the apertures318 of the first tray 310 in superimposition with respective pedestals336 of the pedestal platform 334. In some examples, positioning the trayhandler device 304 in the first position includes the distal end 354 ofeach of the pedestals 336 extending away from the top surface 314 of thefirst tray 310.

The distance between the top surface 314 of the first tray 310 and thetop surface 337 of the pedestal platform 334 is increased (812). Forexample, the actuator module 341 increases the distance between the topsurface 314 of the first tray 310 and the top surface 337 of thepedestal platform 334. In some examples, increasing the distance betweenthe top surface 314 of the first tray 310 and the top surface 337 of thepedestal platform 334 includes transferring the first substrate 360 frombeing positioned on the pedestals 336 to the tabs 324 defined by theapertures 318 of the first tray 310. In some examples, transferring thefirst substrate 360 from being positioned on the pedestals 336 to thetabs 324 defined by the apertures 318 of the first tray 310 includestransferring the first substrate 360 from being positioned on thepedestals 336 to the tabs 324 defined by the aperture 318 of the firsttray 310 while the second tray handler 308 is engaging with the secondtray 312.

The distance between the top surface 316 of the second tray 312 and thebottom surface 330 of the substrate chuck 326 is increased (814). Forexample, the actuator module 343 increases the distance between the topsurface 316 of the second tray 312 and the bottom surface 330 of thesubstrate chuck 326. In some examples, increasing the distance betweenthe top surface 316 of the second tray 312 and bottom surface 330 of thesubstrate chuck 326 includes transferring the second substrate 362 frombeing positioned on the substrate chuck 326 to the tabs 324 defined bythe aperture 320 of the second tray 312.

The tray handler device 302 rotates from the first position to thesecond position (816). For example, the rotational system 342 rotatesthe tray handler device 302 from the first position to a secondposition. In some examples, positioning the tray handler device 302 inthe second position includes having the tabs 324 defined by theapertures 318 of the first tray 310 in superimposition with the channels332 of the substrate chuck 326. In some examples, positioning the trayhandler device 302 in the second position includes having the cutouts322 of each of the apertures 320 the second tray 312 in superimpositionwith the respective pedestals 336 of the pedestal platform 334.

The distance between the top surface 314 of the first tray 310 and thebottom surface 330 of the substrate chuck 326 is decreased (818). Forexamples, the actuator module 341 decreases the distance between the topsurface 314 of the first tray 310 and the bottom surface 330 of thesubstrate chuck 326. In some examples, decreasing the distance betweenthe top surface 314 of the first tray 310 and the bottom surface 330 ofthe substrate chuck 326 includes transferring the first substrate 360from the tabs 324 defined by the aperture 318 of the first tray 310 tothe top surface 322 of the substrate chuck 328 while the tabs 324defined by the aperture 318 of the first tray 310 are disposed withinthe respective channels 332 of the substrate chuck 326.

The first tray handler 306 disengages from the first tray 310 (820). Insome examples, the first tray handler 306 disengages from the first tray310 while concurrently the actuator module 343 decreases a distancebetween the top surface 316 of the second tray 312 and the top surface337 of the pedestal platform 334. In some examples, decreasing thedistance between the top surface 316 of the second tray 312 and the topsurface 337 of the pedestal platform 334 includes transferring thesecond substrate 362 from be positioned on the tabs 324 defined by theaperture 320 of the second tray 312 to the pedestals 336.

The invention claimed is:
 1. An imprint lithography substrate transfermethod, comprising: providing a tray handler device including a firsttray handler positioned opposite a second tray handler; providing afirst tray and a second tray, each of the first and the second traysdefining an aperture and each having a top surface, each aperturedefining at least two cutouts and two tabs; providing a substrate chuckhaving a top surface and a bottom surface; engaging the first trayhandler with the first tray; positioning the tray handler device in afirst position with i) the cutouts of the aperture of the first tray insuperimposition with respective pedestals of a pedestal platform and ii)a distal end of the pedestals extending away from the top surface of thefirst tray; increasing a distance between the top surface of the firsttray and a top surface of the pedestal platform to transfer a firstsubstrate from the pedestals to the tabs defined by the aperture of thefirst tray, while concurrently engaging the second tray handler with thesecond tray; increasing a distance between the top surface of the secondtray and the bottom surface of the substrate chuck to transfer a secondsubstrate from the substrate chuck to the tabs defined by the secondtray; rotating the tray handler device from the first position to asecond position with i) the tabs defined by the aperture of the firsttray in superimposition with respective channels of the substrate chuckand ii) the cutouts of the aperture of the second tray insuperimposition with respective pedestals; decreasing a distance betweenthe top surface of the first tray and the bottom surface of thesubstrate chuck to transfer the first substrate from the tabs defined bythe aperture of the first tray to the top surface of the substrate chuckwhile the tabs defined by the aperture of the first tray are disposedwithin the respective channels of the substrate chuck; and disengagingthe first tray handler from the first tray while concurrently decreasinga distance between the top surface of the second tray and the topsurface of the pedestal platform to transfer the second substrate fromthe tabs defined by the aperture of the second tray to the pedestals. 2.The method of claim 1, further comprising: removing the second substratefrom being positioned on the pedestals; positioning a third substrate onthe pedestals; and after disengaging the first tray handler from thefirst tray, forming a pattern in a material positioned on the firstsubstrate while the first substrate is positioned on the substrate chuckand the first tray is coupled with the substrate chuck.
 3. The method ofclaim 2, further comprising: after forming the pattern in the materialpositioned on the first substrate, engaging the first tray handler withthe first tray while concurrently increasing the distance between thetop surface of the second tray and the top surface of the pedestalplatform to transfer the third substrate from the pedestals to the tabsdefined by the aperture of the second tray.
 4. The method of claim 3,further comprising: after engaging the first tray handler with the firsttray, increasing the distance between the top surface of the first trayand the bottom surface of the substrate chuck to transfer the firstsubstrate from the substrate chuck to the tabs of defined by the firsttray.
 5. The method of claim 4, further comprising: after increasing thedistance between the top surface of the first tray and the bottomsurface of the substrate chuck, rotating the tray handler device fromthe second position to the first position with the cutouts of theaperture of the first tray in superimposition with respective pedestalsof the pedestal platform.
 6. The method of claim 5, further comprisingdecreasing the distance between the top surface of the first tray andthe top surface of the pedestal platform to transfer the first substratefrom the tabs defined by the aperture of the first tray to thepedestals.
 7. The method of claim 6, further comprising decreasing thedistance between the top surface of the second tray and the bottomsurface of the substrate chuck to transfer the third substrate from thetabs defined by the aperture of the second tray to the top surface ofthe substrate chuck while the tabs defined by the aperture of the secondtray are disposed within the respective channels of the substrate chuck.8. The method of claim 1, wherein the second substrate includes apatterned layer positioned thereon prior to transferring the secondsubstrate from the substrate chuck to the tabs defined by the secondtray.
 9. An imprint lithography system, comprising: two or morepedestals of a pedestal platform; a substrate chuck having a top surfaceand a bottom surface, and including channels; a first tray and a secondtray, each of the first and the second trays defining an aperture andeach having a top surface, each aperture defining at least two cutoutsand two tabs; a tray handler device including a first tray handlerpositioned opposite a second tray handler, the first tray handlerengageable with the first tray and the second tray handler engageablewith the second tray, the tray handler device rotatable between firstand second positions, the first position having i) the cutouts of theaperture of the first tray in superimposition with respective pedestalsof the pedestal platform and ii) a distal end of the pedestals extendingaway from the top surface of the first tray, the second position havingi) the tabs defined by the aperture of the first tray in superimpositionwith respective channels of the substrate chuck and ii) the cutouts ofthe aperture of the second tray in superimposition with respectivepedestals; and an actuator system to, when the tray handler device is inthe first position, i) increase a distance between the top surface ofthe first tray and a top surface of the pedestal platform to transfer afirst substrate from the pedestals to the tabs defined by the apertureof the first tray, while concurrently engaging the second tray handlerwith the second tray, and ii) increase a distance between the topsurface of the second tray and the bottom surface of the substrate chuckto transfer a second substrate from the substrate chuck to the tabsdefined by the second tray, and when the tray handler is in the secondposition, i) decrease a distance between the top surface of the firsttray and the bottom surface of the substrate chuck to transfer the firstsubstrate from the tabs defined by the aperture of the first tray to thetop surface of the substrate chuck while the tabs defined by theaperture of the first tray are disposed within the respective channelsof the substrate chuck, and ii) decrease a distance between the topsurface of the second tray and the top surface of the pedestal platformto transfer the second substrate from the tabs defined by the apertureof the second tray to the pedestals while the first tray handler isdisengaged from the first tray.
 10. The system of claim 9, furthercomprising a rotational system to rotate the tray handler device betweenthe first and the second positions.
 11. The system of claim 9, furthercomprising a patterning system to form a pattern in the first substratewhen the first substrate is positioned on the top surface of thesubstrate chuck.
 12. The system of claim 9, the actuator systemcomprising a first actuator module to, when the tray handler device isin the first position, increase the distance between the top surface ofthe first tray and a top surface of the pedestal platform to transfer afirst substrate from the pedestals to the tabs defined by the apertureof the first tray, while concurrently engaging the second tray handlerwith the second tray, and to, when the tray handler device is in thesecond position, decrease the distance between the top surface of thefirst tray and the bottom surface of the substrate chuck to transfer thefirst substrate from the tabs defined by the aperture of the first trayto the top surface of the substrate chuck while the tabs defined by theaperture of the first tray are disposed within the respective channelsof the substrate chuck.
 13. The system of claim 12, the actuator systemcomprising a second actuator module to, when the tray handler is in thefirst position, increase a distance between the top surface of thesecond tray and the bottom surface of the substrate chuck to transfer asecond substrate from the substrate chuck to the tabs defined by thesecond tray, and to, when the tray handler is in the second position,and when the tray handler device is in the second position, decrease thedistance between the top surface of the second tray and the top surfaceof the pedestal platform to transfer the second substrate from the tabsdefined by the aperture of the second tray to the pedestals while thefirst tray handler is disengaged from the first tray.